Cleared—And Verified—For Takeoff

By Rob van Blommestein - 27 Aug, 2020 - Comments: 0

If you’re like me, you’re probably not in any hurry to get on an airplane amidst our current global pandemic. Commercial air travel has declined dramatically as a result of the novel coronavirus—but beyond private and recreational travel, aviation remains an essential component of many key areas of modern life, including military and defense; commerce and package delivery; medical care; s... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 Aug, 2020 - Comments: 0

Tools & IP SiFive announced OpenFive, a self-contained and autonomous business unit that will offer custom silicon solutions with differentiated IP. OpenFive will be led by Dr. Shafy Eltoukhy, SVP, and general manager of OpenFive. OpenFive debuted with a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chipset based designs for networking, HPC, and AI markets. The D2D p... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 21 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Clue Technologies

Cleared—And Verified—For Takeoff

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing