System Bits: April 30

By Jeff Dorsch - 30 Apr, 2019 - Comments: 0

Future batteries could use a graphene sponge Researchers at Sweden’s Chalmers University of Technology devised a porous, sponge-like aerogel, made of reduced-graphene oxide, to serve as a freestanding electrode in the battery cell. This utilization has the potential to advance lithium sulfur batteries, which are said to possess a theoretical energy density about five times greater than lithi... » read more

Power/Performance Bits: April 19

By Jesse Allen - 19 Apr, 2016 - Comments: 0

Ferroelectric non-volatile memory Scientists from the Moscow Institute of Physics and Technology (MIPT), the University of Nebraska, and the University of Lausanne in Switzerland succeeded in growing ultra-thin (2.5-nanometer) ferroelectric films based on hafnium oxide that could potentially be used to develop non-volatile memory elements called ferroelectric tunnel junctions. The film was g... » read more

Power/Performance Bits: Dec. 15

By Jesse Allen - 15 Dec, 2015 - Comments: 0

Biologically powered chip Columbia Engineering researchers powered an integrated circuit from adenosine triphosphate (ATP), the energy currency of life. They achieved this by integrating a conventional solid-state CMOS integrated circuit with an artificial lipid bilayer membrane containing ATP-powered ion pumps, opening the door to creating entirely new artificial systems that contain both b... » read more

Power/Performance Bits: Oct. 21

By Ann Mutschler - 21 Oct, 2014 - Comments: 0

Sound power While medical researchers would like to plant tiny electronic devices deep inside our bodies to monitor biological processes and deliver pinpoint therapies or relieve pain, so far engineers have been unable to make such devices small and useful enough. Providing power to the implants has been one stumbling block, and the use of wires or batteries to deliver power make implants ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Columbia Engineering

System Bits: April 30

Power/Performance Bits: April 19

Power/Performance Bits: Dec. 15

Power/Performance Bits: Oct. 21