Week In Review: Manufacturing, Test

By Mark LaPedus - 10 May, 2019 - Comments: 0

Trade More trade news: "The Trump administration is hiking duties on $200 billion worth of Chinese products to 25% from 10%," according to CNBC. The following is attributed to Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), in response to President Trump’s plan to increase tariffs on $200 billion worth of Chinese imports to 25%: “The president is seeking a bet... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 09 Nov, 2018 - Comments: 0

Internet of Things What’s better than a 5G network? How about a local, private 5G network? The Industrial Internet of Things may drive the development of such networks. Of course, 5G cellular communications technology is still being worked out worldwide. BMW, Daimler, and Volkswagen are looking ahead to the future; those automotive manufacturers notified Germany’s Federal Network Agency th... » read more

Will 5G Deployment Lag in the U.S.?

By Jeff Dorsch - 08 Aug, 2018 - Comments: 0

China and other countries are creating “a 5G tsunami” that the U.S. will not be able to match unless it steps up its national investments in 5G cellular communications, Deloitte Consulting warns in a new report. The firm notes that China has outspent the U.S. on wireless communications infrastructure by $57 billion since 2015, constructing 350,000 new sites, compared with less than 2... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CommScope

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

Will 5G Deployment Lag in the U.S.?

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