The Case For Narrowband-IoT

By Gale Morrison - 08 Mar, 2017 - Comments: 0

Cellular network-based Narrowband IoT (NB-IoT) is marching closer to reality as players across the ecosystem put forth silicon IP, software protocol stacks, carrier network software upgrades and more. The kicker came last year when the 3rd Generation Partnership Project (3GPP), the global cellular industry standards body, finalized a NB-IoT standard in its 'release 13.' With that, device mak... » read more

The Week In Review: Design

By Jesse Allen - 24 Feb, 2017 - Comments: 0

M&A ARM made two acquisitions to add the new NarrowBand-IoT (NB-IoT) low power wide area connectivity standard to its designs: Mistbase, founded in 2015 in Sweden, provides a complete NB-IoT physical layer implementation solution, while London-based NextG-Com, founded in 2008, offers a complete layer two and three software stack for NB-IoT. Tools Synopsys released the latest versio... » read more

The Week In Review: IoT

By Jeff Dorsch - 24 Feb, 2017 - Comments: 0

M&A ARM Holdings this week announced the acquisition of two firms, Mistbase and NextG-Com, to help bring narrowband Internet of Things technology to its chip designs. In addition, the company announced the development of ARM Cordio-N radios to reduce the complexity of adopting cellular IoT connectivity. Meanwhile, Blu Wireless Technology of the U.K. reported that ARM made an equity investment ... » read more

Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: CommSolid

The Case For Narrowband-IoT

The Week In Review: Design

The Week In Review: IoT

Trending Articles

Chip Industry Week In Review

Metrology Advances Step Up To Sub-2nm Device Node Needs

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Startup Funding: Q3 2024

Knowledge Centers
Entities, people and technologies explored