A Primer For The 802.XX Physical Layer

By Ernest Worthman - 07 Oct, 2015 - Comments: 0

This is the second installment of the 802.XX for the IoE series of articles. The first one was published in the August issue and addressed the Media Access Control (MAC) layer. In this article, we will examine the elements of the physical (PHY) layer of the 802.11 protocol stack. For reference, the protocol stack is shown in figure 1. The best designs, like everything else, are built on a so... » read more

BLE For The IoT

By Ernest Worthman - 05 Feb, 2015 - Comments: 0

Bluetooth low-energy (BLE) is one of the emerging disruptive technologies for the IoT. Also referred to as Bluetooth low-power and Bluetooth smart, as the Bluetooth SIG is calling it, this technology will enable the next level of IoT vertical devices, such as medical devices, home automation, retail, wearables, and much more. For consumers, it comes down to the Internet of Your Things (Io... » read more

Smart Grid Security

By Mentor, a Siemens Business - 10 Sep, 2014 - Comments: 0

Smart energy is an all-inclusive term that refers to upgrading the energy grid so it can support bi-directional flow of energy and data. Such an endeavor involves adding connectivity, communication, and security features not only to the smart grid but to the many devices connected to a smart grid. But how do you ensure all devices on the network are secure? This paper looks into two key softwar... » read more

Blog Review: April 2

By Ed Sperling - 02 Apr, 2014 - Comments: 0

Mentor’s Nazita Saye compares roadway roundabouts to networked systems. One roundabout works fine, but add in a bunch of them and you have a massive traffic jam. How many roundabouts are in your design? Cadence’s Richard Goering interviews Stan Kroliskoski, chair of the IEEE Design Automation Standards Committee, about four working groups on EDA standards and what’s ahead. Speaking ... » read more

SoC Integration Mistakes

By Ed Sperling - 13 Feb, 2014 - Comments: 2

Semiconductor Engineering sat down to discuss integration challenges with Ruggero Castagnetti, distinguished engineer at LSI; Rob Aitken, an ARM fellow; Robert Lefferts, director of engineering in Synopsys’ Solutions Group; Bernard Murphy, chief technology officer at Atrenta; and Luigi Capodieci, R&D fellow at GlobalFoundries. What follows are excerpts of that roundtable discussion. SE... » read more

Experts At The Table: What’s Missing In The IoT

By Ed Sperling - 11 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the future of the IoT with Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division; Martin Lund, senior vice president of the IP Group at Cadence; Naveed Sherwani, president and CEO of Open-Silicon; and Damon Hernandez, a member of the Web3D Consortium. What follows are excerpts of that conver... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer