Dealing With Heat In Near-Memory Compute Architectures

The explosion in data forcing chipmakers to get much more granular about where logic and memory are placed on a die, how data is partitioned and prioritized to utilize those resources, and what the thermal impact will be if they are moved closer together on a die or in a package. For more than a decade, the industry has faced a basic problem — moving data can be more resource-intensive tha... » read more

Big Iron Conundrums

Enormous attention is being focused on energy efficiency in mobile devices because time between charges trumps a slight boost in performance. Inside of data centers those benefits are far less clear. While energy costs remain a huge factor—they are a visible part of the bottom line costs for a CIO—how to reduce those costs is anything but a simple equation. Just adding more energy-saving... » read more