Increased Automotive Data Use Raises Privacy, Security Concerns

By John Koon - 07 Mar, 2024 - Comments: 0

The amount of data being collected, processed, and stored in vehicles is exploding, and so is the value of that data. That raises questions that are still not fully answered about how that data will be used, by whom, and how it will be secured. Automakers are competing based on the latest versions of advanced technologies such as ADAS, 5G, and V2X, but the ECUs, software-defined vehicles, an... » read more

Leveraging Vehicle-To-Everything Sidelink Communication For Relative Localization Of Connected Automated Vehicles

By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “V2X Sidelink Localization of Connected Automated Vehicles” was published by researchers at CNR-IEIIT and WiLabCNIT (Italy). Abstract: "Future automated driving relies on two pillars, (i) ultra-low-latency and reliable communications, and (ii) accurate positioning information. In particular, the knowledge of vehicle positions is becoming fundamental with the incre... » read more

Why The SOAFEE Project Is Integral For The Design Of Connected Vehicles

By Stewart Wiliams - 07 Sep, 2023 - Comments: 0

The Scalable Open Architecture for Embedded Edge (SOAFEE) project, of which Synopsys is a voting member, is defined by automakers, semiconductor suppliers, open-source and independent software vendors, and cloud technology leaders. The effort builds on technologies that define standard boot and security requirements for the Arm architecture, while adding a cloud-native development and deployme... » read more

An Advanced Modeling Approach For Cyclic Safety Mechanisms In A Fault Tree Analysis

By Technical Paper Link - 08 Jul, 2023 - Comments: 0

A technical paper titled "Best Practices for Advanced Modeling of Safety Mechanisms in an FTA" was published by researchers at University of Stuttgart, Robert Bosch GmbH, Audi AG, and Porsche AG. Abstract: "To cope with the megatrends electrification, automated driving, and connectivity, new functionalities and electric and/or electronic systems must be developed, which require a safe power s... » read more

HD Map (EdgeMap) Crowdsources Data From Connected Vehicles in Auto Edge Computing

By Technical Paper Link - 30 Apr, 2022 - Comments: 0

New research paper from University of Nebraska-Lincoln, Xidian University and University of North Carolina at Charlotte. Abstract "High definition (HD) map needs to be updated frequently to capture road changes, which is constrained by limited specialized collection vehicles. To maintain an up-to-date map, we explore crowdsourcing data from connected vehicles. Updating the map collaborati... » read more

Securing Connected And Autonomous Vehicles

By Andy Gothard - 02 Dec, 2021 - Comments: 0

Vehicles are on track to become highly sophisticated Internet of Things (IoT) devices. With the added functionality that connects vehicles to other vehicles, the infrastructure, and even pedestrians, the opportunity for hacking expands. Challenges like complexity and the burden of legacy systems further complicate the situation. The future of connected and autonomous vehicles (CAV) demands leve... » read more

Automotive Electronics: Driving The Semiconductor Market

By Jim Feldhan - 16 Aug, 2018 - Comments: 0

Automotive electronics is the fastest growing end application in the semiconductor market, but what systems will see the highest penetration rates? Currently, self-driving cars grab much of the media attention, and for good reason. Semico estimates that today’s self-driving car has $21,525 of additional electronics. However, recent tests of ADAS vehicles produced less than stellar results. II... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer