Cybersecurity Risks Of Automotive OTA

By John Koon - 01 Dec, 2022 - Comments: 0

Modern vehicles increasingly resemble supercomputers on wheels, with many electronic control units (ECUs) networked together as increasingly sophisticated software is installed and updated. Similar to smartphones, vehicle OEMs will contact vehicle owners remotely about operating system updates that add new features and/or fixes, as well as software bugs and vulnerabilities. But all of this h... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Aug, 2021 - Comments: 0

Automotive The New York Auto Show has been canceled due to concerns over the COVID-19 Delta variant. The show, which usually occurs in April, was scheduled for August 20 through 29th. Semiconductor company Qualcomm has offered to acquire Veoneer, an ADAS company, for $37 per share in cash. Automotive Tier 1 Magna International already has a definitive merger agreement to acquire Veoneer, wh... » read more

Automotive Lidar Technologies Battle It Out

By Bryon Moyer - 05 Aug, 2021 - Comments: 1

Lidar is likely to be added to the list of sensors that future cars will use to help with navigation and safety, but most likely it won't be the large rotating mirror assembly on the top of vehicles. Newer solid-state radar technologies are being researched and developed, although it’s not yet clear which of these will win. “The benefits of lidar technology are well known dating back to ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Continental AG

Cybersecurity Risks Of Automotive OTA

Week In Review: Auto, Security, Pervasive Computing

Automotive Lidar Technologies Battle It Out

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored