tag: CoreWeave

Chip Industry Week in Review

By The SE Staff - 16 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Week In Review: Design, Low Power

By SE Staff - 28 Jul, 2023 - Comments: 0

Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Trending Articles

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Chip Industry Week in Review

China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup deal; Siemens buys Excellicon; chip revenue challenges; France's new OSAT.

by The SE Staff

Chip Industry Week in Review

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN sensor; IoT Wi-Fi 7; new e-beam lithography facility; more earning reports; Apple's 19B chips in U.S.

by The SE Staff

Radiation, Temperature, Power Challenges For Chips In Space

Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is also needed.

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Optimization of Oxygen Plasma Conditions for Cu-Cu Bonding

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