IoT’s Many Different Forms

By Jeff Dorsch - 07 Dec, 2017 - Comments: 1

The Internet of Things is settling into widespread industrial applications, along with precision agriculture, while consumer IoT continues to find its way into the home through smart speakers and their digital assistants, such as Amazon Echo, Apple HomeKit, and Google Home. The Internet of Cows and the Internet of Tomatoes may sound like fanciful subjects, yet there is serious technology in ... » read more

Where MEMS Can Boldly Go Now

By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 03 Feb, 2017 - Comments: 0

Manufacturing Veeco Instruments has signed a definitive agreement to acquire Ultratech. With the deal, Veeco will enter into the lithography market for chip-packaging as well as the laser spike anneal business. Veeco is a supplier of MOCVD tools. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million. FlexTech, a SE... » read more

Manufacturing Bits: Aug. 2

By Mark LaPedus - 02 Aug, 2016 - Comments: 0

CMP replacement? For years, chipmakers have used chemical-mechanical-polishing (CMP) tools to smooth or polish the surface of a wafer. CMP works, but the technology is time-consuming and expensive. CMP can also leave unwanted residual patterns and defects near the surface. In response, Russia’s National Research Nuclear University MEPhI (Moscow Engineering Physics Institute) has help... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Corning

IoT’s Many Different Forms

Where MEMS Can Boldly Go Now

The Week In Review: Manufacturing

Manufacturing Bits: Aug. 2