Welcome To EDA 4.0 And The AI-Driven Revolution

By Dan Yu - 01 Jun, 2023 - Comments: 1

By Dan Yu, Harry Foster, and Tom Fitzpatrick Welcome to the era of EDA 4.0, where we are witnessing a revolutionary transformation in electronic design automation driven by the power of artificial intelligence. The history of EDA can be delineated into distinct periods marked by significant technological advancements that have propelled faster design iterations, improved productivity, and fu... » read more

(Artificially) Intelligent Verification

By Brian Bailey - 01 Jun, 2020 - Comments: 1

Functional verification produces a lot of data, , but does that make it suitable for Artificial Intelligence (AI) or Machine Learning (ML)? Experts weigh in about where and how AI can help and what the industry could do to improve the benefits. "It's not necessarily the quantity," says Harry Foster, chief scientist for verification at Mentor, a Siemens Business. "It's the quality that matter... » read more

Localized, System-Level Protocol Checks And Coverage Closure

By Various Writers - 23 Apr, 2014 - Comments: 0

Broadcom recently developed a unified, scalable, verification methodology based on the Veloce emulation platform. In order to test this new environment, they ran a test case, which proved that they can take assertions, compile them into Veloce, and verify that they fire accurately. In so doing, they were able to provide proof of concept for their primary goal: the creation of an internal flow t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Coverage Closure

Welcome To EDA 4.0 And The AI-Driven Revolution

(Artificially) Intelligent Verification

Localized, System-Level Protocol Checks And Coverage Closure