Welcome To EDA 4.0 And The AI-Driven Revolution

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• Jesse KO on Advanced Packaging Drives Test And Metrology Innovations
• Dinesh Kumar on Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1
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• JOH-POYO on FOPLP Gains Traction in Advanced Semiconductor Packaging
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• Theodore Wilson on Shift Left Is The Tip Of The Iceberg
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• A Duck on Batteries Look Beyond Lithium
• atharva on 2D Semiconductors Make Progress, But So Does Silicon
• Allan Cox on Big Changes Ahead For Analog Design
• S on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• AI Research Scientist on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
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• Henley on A Buyers Guide To An NPU
• Joe L on Chip Industry Week in Review
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• Lincoln B on Blog Review: Aug. 7
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
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• Dr. Dev Gupta on Chiplet IP Standards Are Just The Beginning
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• Chris G on Intel, And Others, Inside
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• Liz Allan on Rethinking Engineering Education In The U.S.
• Telkom University on Rethinking Engineering Education In The U.S.
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