Raymond Nijssen, vice president of systems engineering at Achronix, discusses on-chip and process variation at 7nm and 5nm, the role of embedded FPGAs, and how to reduce margin and pessimistic designs.
https://youtu.be/LQnw_3H9soQ
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Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.
Infineon’s 300mm power GaN wafer; SIA’s state of the industry report; India’s IC buzz; mandatory AI reporting; conference announcements; secure chips for space.
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
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