Chip Industry Week In Review

By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Semiconductor Photomask Market Poised For Another Year Of Growth

By Jan Willis - 19 Sep, 2024 - Comments: 0

The semiconductor photomask market, a crucial component in chip manufacturing, is on track for another year of robust growth. This growth trajectory is supported by a series of technological advancements and market trends that continue to drive innovation in the industry. As the annual SPIE Photomask Technology Conference approaches in early October in Monterey, California, it presents an oppor... » read more

Key Technologies To Extend EUV To 14 Angstroms

By Laura Peters - 29 Jul, 2024 - Comments: 3

The top three foundries plan to implement high-NA EUV lithography as early as 2025 for the 18 angstrom generation, but the replacement of single exposure high-NA (0.55) over double patterning with standard EUV (NA = 0.33) depends on whether it provides better results at a reasonable cost per wafer. So far, 2024 has been a banner year for high-numerical aperture EUV lithography. Intel Foundry... » read more

European Mask And Lithography Conference 2024 Worth Attending

By Asmus Hetzel - 23 Jul, 2024 - Comments: 0

The European Mask and Lithography Conference (EMLC) 2024 recently was held in Grenoble, France, and had about 190 participants from a wide range of companies and institutions. Being relatively new to the field of lithography (my background is EDA, machine learning, optimization) and not being a fan of gigantic conferences, I thought it would be a good idea to visit this conference. My main p... » read more

CD Spec For Curvilinear Masks

By D2S - 23 Jul, 2024 - Comments: 0

Within the photomask industry, there's a major transformation from conventional Manhattan masks to more advanced curvilinear masks. Researchers from D2S and Micron Technology propose an equivalent CD spec for the curvy masks and use this spec to show that curvy masks have smaller mask variations than Manhattan masks. Find the technical paper here. Published June 2024. Linyong (Leo) Pang, ... » read more

Single Vs. Multi-Patterning Advancements For EUV

By Gregory Haley - 20 Jun, 2024 - Comments: 0

As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies. While the basic lithography process hasn’t changed since the founding of the industry — exposing light through a reticle onto a prepared silicon wafer — the techniques and technology ... » read more

Photoresist Materials Development

By Toru Fujimori - 20 Jun, 2024 - Comments: 0

Toru Fujimori of FUJIFILM Corporation provides an overview of the development of photoresist materials for masks and wafers to support continued pattern shrinkage and address stochastic issues in lithography. » read more

GPU Acceleration for Pixel-based Computing in Various Mask Processing and Verification Steps

By D2S - 20 Jun, 2024 - Comments: 0

A technical paper titled "Leaping into the curvy world with GPU accelerated O(p) computing" was published by researchers at D2S, Inc. The papers discusses the advantages of using GPU acceleration for pixel-based computing during various mask processing and verification steps. It found that the O(p) approach for GPU acceleration is effective in handling data processing for curvy masks. F... » read more

Opportunities Grow For GPU Acceleration

By Gregory Haley - 05 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of GPU acceleration on mask design and production and other process technologies, with Aki Fujimura, CEO of D2S; Youping Zhang, head of ASML Brion; Yalin Xiong, senior vice president and general manager of the BBP and reticle products division at KLA; and Kostas Adam, vice president of engineering at Synopsys. W... » read more

A Wrap-Up Of Photomask Japan 2024

By Ingo Bork - 23 May, 2024 - Comments: 0

This year, I had the opportunity to attend the 30th Symposium on Photomask and NGL Mask Technology, also called Photomask Japan 2024 (PMJ), in Yokohama, Japan, from April 16 to 18. This well-regarded symposium brings together engineers from all over the world to share ideas on photomasks, NGL masks and related technologies. It was great being back to an in-person conference after four years ... » read more

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