Samsung PM9A3 All Flash Reference Platform

By Samsung - 14 Dec, 2022 - Comments: 0

Software Defined Storage continues to gain momentum in the modern datacenter storage market. As datacenter storage in- frastructures and technologies evolve, the need for speed and flexibility in the storage system becomes evident. NVMe is at the forefront of these advancements. Weka is a software defined storage system that is designed to meet the needs of today’s I/O intensive workloads. It... » read more

Are Chips Getting More Reliable?

By Ed Sperling - 28 Jan, 2016 - Comments: 4

Reliability is emerging as a key metric in the semiconductor industry, alongside of power, performance and cost, but it also is becoming harder to measure and increasingly difficult to achieve. Most large semiconductor companies look at reliability in connection with consumer devices that last several years before they are replaced, but a big push into automotive, medical and industrial elec... » read more

System Bits: Sept.1

By Ann Mutschler - 01 Sep, 2015 - Comments: 0

The quantum description of nature In quantum mechanics, the underlying physical rules that govern the fundamental behavior of matter and light at the atomic scale state that nothing can quite be completely at rest, but now for the first time, a team of researchers from Caltech, McGill University, and the Max Planck Institute for the Science of Light has found a way to observe—and control—t... » read more

Datacenter Power Is Different

By Ann Mutschler - 11 Sep, 2014 - Comments: 1

With much focus on super low power devices for handhelds and IoT applications, I’m also interested in what’s happening at the seeming other end of the spectrum, in the datacenter. Atrenta CTO Bernard Murphy rightly pointed out that when it comes to power reduction techniques, datacenter power is a different story. He reminded that at a unit-level, a lot has already been done or is underw... » read more

Rethinking Big Iron

By Ed Sperling - 13 Jun, 2013 - Comments: 0

By Ann Steffora Mutschler One size does not fit all when it comes to the server market, and that may be the best option for low-power processor makers to gain a toehold in a world that until now has been almost laser-focused on performance. Even higher-performance versions of low-power processing architectures are starting to show up inside of datacenters. Many are application-specific ... » read more

It’s All About Power

By Ann Mutschler - 08 Apr, 2010 - Comments: 0

In my last entry regarding IBM’s claim for new x86 technology for the datacenter, I mentioned I was trying to get an answer from IBM regarding details on the “silicon innovation” it used. That quest is ongoing, and I hope to find some actual technology, and not just marketing mumbo-jumbo at the heart of it. Keep checking back, I will give my report here. Just a few weeks after Big Blue... » read more

New x86 Technology For The Datacenter?

By Ann Mutschler - 11 Mar, 2010 - Comments: 0

I wasn’t too surprised when IBM announced new servers early this month that they claim “break constraints of 30-year technology design,” since Big Blue is constantly releasing new products that they say are groundbreaking in one way or another. Reading deeper into the news, IBM is using new semiconductor technology at the heart of its new eX5 servers that it said took its engineering t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer