tag: datapath planning

The Seven Pillars Of IC Package Physical Design

By Keith Felton - 15 Feb, 2024 - Comments: 0

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what can be currently achieved in traditional monolithic SoC designs. Figure 1. A heterogeneously integrated device with 47 chiplets. (Image Source: Intel) The evolving landscape of packagin... » read more

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Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

Americas Chip Funding Energizes Industry

Massive government infusions aim to improve security and supply chain robustness.

Advanced Packaging Driving New Collaboration Across Supply Chain

Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.

by Gregory Haley

Chiplets Make Progress Using Interconnects As Glue

Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.

by Ann Mutschler

2D Semiconductors Make Progress, But So Does Silicon

Can 2D materials be fabricated consistently at a cost that competes with silicon?

by Katherine Derbyshire

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