Decarbonizing Commercial Vehicles with Infineon Semiconductors

By Infineon - 03 Jul, 2024 - Comments: 0

Commercial, construction and agricultural vehicles (CAVs) are the backbone of industries that drive our global economy. Motivated by recent developments, the CAV industry is now undergoing a radical change: the journey toward electrification--from CAVS to eCAVs. The electrification of CAVs is a huge and promising challenge in which the semiconductors play a crucial role. Find more informatio... » read more

Environmental Impact of Semiconductor Manufacturing (ORNL)

By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A technical paper titled "Cleaner Chips: Decarbonization in Semiconductor Manufacturing" was published by researchers at Oak Ridge National Laboratory (ORNL) / UT-Battelle. Abstract: "The growth of the information and communication technology sector has vastly accelerated in recent decades because of advancements in digitalization and Artificial Intelligence (AI). Scope 1, 2, and 3 gree... » read more

Collaborating To Decarbonize The Semiconductor Manufacturing Value Chain

By Mousumi Bhat - 18 Aug, 2022 - Comments: 0

By Mousumi Bhat and Peter Spiller SEMICON West 2022 Hybrid gathered experts from across the semiconductor industry for the debut Sustainability Summit to talk about the sustainability of the industry’s growth. Semiconductor chips have become ubiquitous in recent years. All aspects of society have become extremely dependent on semiconductors. The post-pandemic revenue growth of semicondu... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: decarbonization

Decarbonizing Commercial Vehicles with Infineon Semiconductors

Environmental Impact of Semiconductor Manufacturing (ORNL)

Collaborating To Decarbonize The Semiconductor Manufacturing Value Chain