Where All The Semiconductor Investments Are Going

By Ed Sperling - 17 Nov, 2022 - Comments: 2

Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

Much Smarter Manufacturing

By Ed Sperling - 22 Oct, 2020 - Comments: 0

Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Dec, 2018 - Comments: 0

Internet of Things Arm made five 2019 predictions for the Internet of Things. They are: The intelligent home goes mainstream; personalized delivery options; improved health-care service; smart cities seek to improve revenue streams and citizen engagement; and smart buildings use more technology for efficiencies. The company also commissioned a worldwide survey of 2,000 consumers, conducted by ... » read more

Will 5G Deployment Lag in the U.S.?

By Jeff Dorsch - 08 Aug, 2018 - Comments: 0

China and other countries are creating “a 5G tsunami” that the U.S. will not be able to match unless it steps up its national investments in 5G cellular communications, Deloitte Consulting warns in a new report. The firm notes that China has outspent the U.S. on wireless communications infrastructure by $57 billion since 2015, constructing 350,000 new sites, compared with less than 2... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Deloitte Consulting

Where All The Semiconductor Investments Are Going

Much Smarter Manufacturing

Week in Review: IoT, Security, Auto

Will 5G Deployment Lag in the U.S.?

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