Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Steps are being taken to minimize problems, but they will take years to implement.
Disaggregation and the wind-down of Moore’s Law have changed everything.
