Improving AI Productivity With AI

By Ed Sperling - 28 Nov, 2023 - Comments: 0

AI is showing up or proposed for nearly all aspects of chip design, but it also can be used to improve the performance of AI chips and to make engineers more productive earlier in the design process. Matt Graham, product management group director at Cadence, talks with Semiconductor Engineering about the role of AI in identifying patterns that are too complex for the human brain to grasp, how t... » read more

How to nail functional safety in your next design

By Neil Stroud - 14 Dec, 2018 - Comments: 0

As the automotive industry accelerates innovation toward fully autonomous vehicles, one of the underlying values of this effort will be safer roadways. Nine in 10 vehicle accidents are caused by human error. Work underway, and future innovation in autonomous and semi-autonomous vehicles, should shrink driving fatalities by tens of thousands in much the same way that the introduction of seat bel... » read more

Impacts Of Reliability On Power And Performance

By Ann Mutschler - 13 Dec, 2018 - Comments: 0

Making sure a complex system performs as planned, and providing proper access to memories, requires a series of delicate tradeoffs that often were ignored in the past. But with performance improvements increasingly tied to architectures and microarchitectures, rather than just scaling to the next node, approaches such as determinism and different kinds of caching increasingly are becoming criti... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: determinism

Improving AI Productivity With AI

How to nail functional safety in your next design

Impacts Of Reliability On Power And Performance