Solutions For Mixed-Signal IP, IC, And SoC Implementation

By Various Writers - 28 Mar, 2013 - Comments: 0

Traditional mixed-signal design environments, in which analog and digital parts are implemented separately, are no longer sufficient and lead to excess iteration and prolonged design cycle time. Realizing modern mixed-signal designs requires new flows that maximize productivity and facilitate close collaboration among analog and digital designers. This paper outlines mixed-signal implem... » read more

Raising The Stakes For IP

By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling As the amount of IP in an SoC increases, so do the number of players who want to strengthen their position in this market. The big acquisitions that began several years ago over time have proved to be just opening salvos—something that was impossible to predict when this shift began. Synopsys’ purchase of Virage Logic and Cadence’s purchase of Denali, both of which occu... » read more

Building A Better Team

By Ed Sperling - 25 Aug, 2010 - Comments: 0

One-On-One with IDT CEO Ted Tewskbury: How IDT is bridging the analog and digital engineering worlds with a mixed-signal team approach. [youtube vid=TRfJ5a3WJrw] » read more

Exclusive Research: What’s Happening With Third-Party IP

By Ed Sperling - 27 Mar, 2009 - Comments: 0

Analog and mixed signal IP began closing the gap with digital core IP in design explorations in the first two months of this year, a clear sign that multicore systems on chip have emerged as the dominant semiconductor model and that the architecture requires both types of IP. While it’s too early to tell this year what effect that will have on overall design activity—the economy is the rea... » read more

Thinking Digital To Design Analog, And Vice Versa

By Ed Sperling - 27 Mar, 2009 - Comments: 0

By Ed Sperling Until several years ago, analog was a world apart from digital. Analog engineers could comfortably avoid many of the issues of Moore’s Law, viewing it as a costly bad habit with an equally bad outcome. Most analog engineers gloated privately that they could still develop chips at 250nm, or at worst 130nm, while their digital counterparts were struggling to keep up with is... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: digital

Solutions For Mixed-Signal IP, IC, And SoC Implementation

Raising The Stakes For IP

Building A Better Team

Exclusive Research: What’s Happening With Third-Party IP

Thinking Digital To Design Analog, And Vice Versa