Chen Wang, senior vice president of engineering at Flex Logix, talks about how to improve density in embedded FPGAs.
https://youtu.be/Rk0oqzWQr8I » read more
Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test.
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
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