Manufacturing Bits: Aug. 28

By Mark LaPedus - 28 Aug, 2018 - Comments: 0

Neutron scattering The Department of Energy’s Oak Ridge National Laboratory has reached what the agency says is the world’s highest power level for a neutron source. Oak Ridge has several facilities, including the so-called Spallation Neutron Source (SNS). The SNS is used in a metrology field called neutron scattering. Used in physics, chemistry, biology, and materials science, neutron ... » read more

Manufacturing Bits: July 16

By Mark LaPedus - 16 Jul, 2018 - Comments: 0

Levitating metrology The Instituto de Ciencias Físicas UNAM has developed a new contaminant detection technique. It uses sound waves to levitate droplets of water for sampling purposes. Researchers use a technique called laser induced breakdown spectroscopy (LIBS). The technique analyzes heavy metals in levitating drops of water, according to The Optical Society (OSA) journal Optics Letter... » read more

Manufacturing Bits: April 17

By Mark LaPedus - 17 Apr, 2018 - Comments: 0

Finding metallic glass Using machine learning techniques, a group of researchers have accelerated the discovery of an alloy called metallic glass. Northwestern University, the Department of Energy’s National Accelerator Laboratory and the National Institute of Standards and Technology (NIST) have devised a shortcut for discovering and improving metallic glass. In metallic glass, the at... » read more

Manufacturing Bits: April 3

By Mark LaPedus - 03 Apr, 2018 - Comments: 0

World's brightest accelerator Japan’s High Energy Accelerator Research Organization (KEK) is readying what is considered the world’s most luminous or brightest particle accelerator. The system, dubbed the SuperKEKB, combines an electron-positron collider with a new and advanced detector. The storage ring system is designed to explore and measure rare decays of elementary particles, such... » read more

Manufacturing Bits: March 20

By Mark LaPedus - 20 Mar, 2018 - Comments: 0

Giant thermometer The Department of Energy's Oak Ridge National Laboratory has devised a new way to take the temperature of a material at the nanoscale—the organization has developed a giant thermometer. The technology, dubbed electron energy gain spectroscopy, enables researchers to take the temperature of a material from an area at about a billionth of a meter wide. Developed by Nion, t... » read more

Manufacturing Bits: Feb. 27

By Mark LaPedus - 27 Feb, 2018 - Comments: 0

Magnesium-ion batteries Texas A&M University and others have discovered a new metal-oxide magnesium battery cathode material—a technology that promises to deliver a higher density of energy storage than today’s traditional lithium-ion (Li-ion) cells. Magnesium-ion battery technology is promising. A battery consists of an anode (negative), cathode (positive), electrolytes and a separat... » read more

Manufacturing Bits: Feb. 20

By Mark LaPedus - 20 Feb, 2018 - Comments: 0

Hedgehog spin-vortex crystals The U.S. Department of Energy’s Ames Laboratory has discovered a missing piece to enable novel superconductor devices--the hedgehog spin-vortex crystal phase. Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on ... » read more

Manufacturing Bits: Jan. 2

By Mark LaPedus - 02 Jan, 2018 - Comments: 0

World’s coldest chip Using a network of nuclear refrigerators, the University of Basel and others claim to have set the record for the world’s coldest chip. Researchers have cooled a chip to a temperature lower than 3 millikelvin. A millikelvin is one thousandth of a kelvin. Absolute zero is 0 kelvin or minus 273.15 °C. In the experiment, researchers used a chip that includes a Coulomb... » read more

New Materials For Computing

By Ed Sperling - 12 Oct, 2017 - Comments: 0

The U.S. Department of Energy rolled out a new program to develop materials for "extreme conditions" for high-performance computing, setting the stage for much more mobile versions of AI and machine learning. This effort, if successful, has interesting implications on a number of levels. For one, the DOE's mandate includes everything from energy security to weaponry, and high-performance com... » read more

Manufacturing Bits: Sept. 19

By Mark LaPedus - 19 Sep, 2017 - Comments: 1

Ion implant lithography At a recent conference, the University of California at Berkeley presented more details about its efforts to develop a multiple patterning method using tilted ion implantation (TII) technology. TII is somewhat similar today’s self-aligned double patterning (SADP) processes in logic and memory. SADP and the follow-on technology, self-aligned quadruple (SAQP), enable... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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