Manufacturing Bits: April 26

By Mark LaPedus - 26 Apr, 2016 - Comments: 0

Multi-beam inspection For some time, Singaporean startup Maglen has been developing a multi-beam e-beam inspection tool technology. Now, Maglen has reached two milestones. First, it has devised a full column test stand. The test stand includes a mechanical column and software. The second milestone is also significant. “We also dropped our beam and obtained our very first images,” sai... » read more

Manufacturing Bits: April 19

By Mark LaPedus - 19 Apr, 2016 - Comments: 0

Hot videos The University of Minnesota has recorded videos that show how heat travels through materials, a move that could give researchers insight into the behavior of atoms and other structures. It could also pave the way towards the development of more efficient materials for use in electronics and other applications. In the lab, researchers used FEI’s transmission electron microsc... » read more

Manufacturing Bits: April 5

By Mark LaPedus - 05 Apr, 2016 - Comments: 0

Food in 3D Using a technology called ptychographic X-ray computed tomography, the University of Copenhagen and the Paul Scherrer Institute have taken images of food in three dimensions and on a nanometer scale. Ptychography, a lensless coherent imaging technique, could potentially save the food industry money. It could reduce food waste due to faulty production methods. Ptychography could ... » read more

Manufacturing Bits: March 29

By Mark LaPedus - 29 Mar, 2016 - Comments: 0

Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more

Manufacturing Bits: March 1

By Mark LaPedus - 01 Mar, 2016 - Comments: 0

Gravitational-wave observatories India has approved the construction of the world’s third gravitational-wave observatory. This facility will replicate the two Laser Interferometer Gravitational-wave Observatories (LIGOs) in the United States, which recently detected the world's first gravitational waves. The Indian project, dubbed LIGO-India, is expected to go online in 2023. The effort b... » read more

Manufacturing Bits: Feb. 23

By Mark LaPedus - 23 Feb, 2016 - Comments: 1

EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

Manufacturing Bits: Feb. 9

By Mark LaPedus - 09 Feb, 2016 - Comments: 1

3D chip consortium The 3D integration consortium of IRT Nanoelec has a new member--EV Group. Based in Grenoble, France, IRT Nanoelec is an R&D center headed by CEA-Leti. Formed in 2012, the 3D integration consortium is one of IRT’s core programs. EV Group joins Leti, Mentor Graphics, SET and STMicroelectronics as members of the 3D consortium. The program is developing a 3D integration ... » read more

Manufacturing Bits: Nov. 17

By Mark LaPedus - 17 Nov, 2015 - Comments: 0

Speedy nano-scale subs For years, researchers have been developing nano-scale submarines. In theory, nano-subs could be used in various applications. For example, they could navigate inside the human body and transport medicine to various organs. The problem? Most nano-subs use or generate toxic chemicals, according to researchers from Rice University. Seeking to solve the problem, Rice ... » read more

Manufacturing Bits: Nov. 3

By Mark LaPedus - 03 Nov, 2015 - Comments: 0

World’s fastest phototransistor The University of Wisconsin-Madison has developed what the university claims is the world’s fastest and most responsive flexible silicon phototransistor. Phototransistors are semiconductor light sensors. They are based on a transistor with a transparent cover. They provide better sensitivity than a photodiode. The futuristic phototransistor from the Un... » read more

Manufacturing Bits: Oct. 13

By Mark LaPedus - 13 Oct, 2015 - Comments: 0

Exploring plasmas with lasers The Department of Energy’s SLAC National Accelerator Laboratory has upgraded its high-power laser system to 200 terawatts of power, roughly 100 times the world’s total power consumption compressed into tens of femtoseconds. The peak power before the upgrade was 30 terawatts. The upgraded laser will be coupled with SLAC's X-ray laser, dubbed the Linac Cohere... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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