Cyber Threats To The SECS/GEM Protocol In Smart Manufacturing

By YenTing Lee - 02 Jul, 2024 - Comments: 0

Semiconductors are an indispensable part of modern electronic products and are also a fundamental basis for the development of the AI industry. This industry is crucial for global economic growth and national security. As the semiconductor industry transitions to Industry 4.0, the connection between production equipment and factory networks has expanded the attack surface, providing adversaries... » read more

A Survey Of Recent Advances And Research Activities In Wireless NoC Security

By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “Wireless Network-on-Chip Security Review: Attack Taxonomy, Implications, and Countermeasures” was published by researchers at Macquarie University (Sydney). Abstract: "Network-on-chip (NoC) is a critical on-chip communication framework that underpins high-performance multicore computing and network system architectures. Its adoption has become widespread due to t... » read more

Health Care Is Gold Mine For Hackers

By John Koon - 24 Jan, 2022 - Comments: 0

Today’s digital health care systems are facing relentless cyberattacks, which are targeting health care organizations as well as the medical devices they use. The critical nature and size of the U.S. health care market — an estimated $3.5 trillion in 2020, with substantial growth anticipated — make it a favorite target of hackers. Vanson Bourne conducted a survey for Sophos in early 20... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DoS

Cyber Threats To The SECS/GEM Protocol In Smart Manufacturing

A Survey Of Recent Advances And Research Activities In Wireless NoC Security

Health Care Is Gold Mine For Hackers