2024 Open Source Risk In M&A By The Numbers

By Synopsys - 08 May, 2024 - Comments: 0

Here’s what we know: Most of today’s codebases contain open source components. Vulnerabilities and licensing issues in codebases are as pervasive as open source itself. Unpatched software vulnerabilities are one of the biggest cyberthreats organizations face. Failure to comply with open source licenses can put businesses at significant risk of litigation and threat to IP. T... » read more

When It Makes Sense To Perform An Open Source Audit

By Synopsys - 02 Jun, 2021 - Comments: 0

Today's software is not created so much as assembled. The parts that serve as ingredients come from a variety of sources, but mostly from the millions of open source components freely available on the internet. This has enabled a digital transformation in several industries, helping market leaders speed their time to market, lower costs, and improve innovation. But what are the licensing and... » read more

Software Due Diligence: A Buyer’s Checklist And Guidelines

By Synopsys - 02 Dec, 2020 - Comments: 0

The potential risk and exposure posed by M&A transactions demand thorough and robust due diligence practices. When an acquisition involves software, it's critical to ensure that associated risks are identified and fully understood. Knowing what questions to ask when performing due diligence is key to avoiding potential risks and legal complications. This is especially true for the acquisiti... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: due diligence

2024 Open Source Risk In M&A By The Numbers

When It Makes Sense To Perform An Open Source Audit

Software Due Diligence: A Buyer’s Checklist And Guidelines