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Chip-Package Co-Analysis Using Ansys RedHawk-CPA


Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Getting A Complete Picture Of Automotive Software


The automotive industry is currently undergoing a major disruption, usually referred as the shift to automated, connected, electric, and shared vehicles (ACES[1]). Naturally, these changes also have a significant impact on the requirements of the hard- and software architectures of these new vehicles: Service-oriented software architectures used by multiple applications running on generali... » read more

Defining Sufficient Coverage


Semiconductor engineering sat down to discuss the definition of sufficiency of coverage as a part of verification closure with Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Willard Tu, director of embedded segment marketing for [getentity id="22186" comment="ARM"]; Larry Vivolo was, at the time of this roundtable, senior director of product marketing for [get... » read more