Takeaways From The 2024 SPIE Photomask Technology + EUV Conference


In the autumn, I had the opportunity to attend the 2024 SPIE Photomask Technology and EUV Lithography conferences, collectively referred to as PUV or sometimes BACUS, the latter a reference to the event’s early association with the BACUS organization. This is a key annual event that brings together experts and professionals in photomask technology and EUV lithography. This year’s conference... » read more

Luminary Panel Sees Progress In EUV Pellicle Adoption As Critical For EUV


A significant focus of the 2024 SPIE Photomask and EUV conference was on EUV lithography and high-numerical-aperture (high-NA) EUV lithography, offering the potential to drive resolution to new heights. These EUV solutions bring new challenges such as pellicles, mask inspection, and smaller and smaller minimum mask dimensions. Progress has been impressive, according to lithography luminary Dr. ... » read more

Luminary Panel Sees Multi-Beam Mask Writers And Curvilinear Masks Key To 193i And EUV


Attendance was up and the mood was optimistic at this year’s SPIE Photomask and EUV conference held September 29 through October 3, 2024. The optimism was apparent as well for multi-beam mask writers and curvilinear masks during the eBeam Initiative’s 15th annual reception and meeting held on October 1. In the eBeam Initiative’s annual Luminaries survey, 93% of those surveyed said that pu... » read more

Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Semiconductor Photomask Market Poised For Another Year Of Growth


The semiconductor photomask market, a crucial component in chip manufacturing, is on track for another year of robust growth. This growth trajectory is supported by a series of technological advancements and market trends that continue to drive innovation in the industry. As the annual SPIE Photomask Technology Conference approaches in early October in Monterey, California, it presents an oppor... » read more

European Mask And Lithography Conference 2024 Worth Attending


The European Mask and Lithography Conference (EMLC) 2024 recently was held in Grenoble, France, and had about 190 participants from a wide range of companies and institutions. Being relatively new to the field of lithography (my background is EDA, machine learning, optimization) and not being a fan of gigantic conferences, I thought it would be a good idea to visit this conference. My main p... » read more

Photoresist Materials Development


Toru Fujimori of FUJIFILM Corporation provides an overview of the development of photoresist materials for masks and wafers to support continued pattern shrinkage and address stochastic issues in lithography. » read more

A Wrap-Up Of Photomask Japan 2024


This year, I had the opportunity to attend the 30th Symposium on Photomask and NGL Mask Technology, also called Photomask Japan 2024 (PMJ), in Yokohama, Japan, from April 16 to 18. This well-regarded symposium brings together engineers from all over the world to share ideas on photomasks, NGL masks and related technologies. It was great being back to an in-person conference after four years ... » read more

eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography


The eBeam initiative celebrated its 15th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to mark the milestone. The eBeam Initiative welcomed its 53rd member, FUJIFILM Corporation, having grown from 20 members and advisors at its launch. FUJIFILM is the first company from the chemical supply... » read more

Make The Impossible Possible: Use Variable-Shaped Beam Mask Writers And Curvilinear Full-Chip Inverse Lithography Technology For 193i Contacts/Vias With Mask-Wafer Co-Optimization


Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patterns in a reasonable write time. We jointly study and present the benefits of a full-chip, curvilinear, stitchless ILT with mask-wafer co-optimization (MWCO) for variable-shaped beam (VSB) mask writers and validate its benefits on mask and wafer at Micron Tec... » read more

← Older posts