System Bits: July 10

By Jeff Dorsch - 10 Jul, 2019 - Comments: 0

Light waves run on silicon-based chips Researchers at the University of Sydney’s Nano Institute and Singapore University of Technology and Design collaborated on manipulating light waves on silicon-based microchips to keep coherent data as it travels thousands of miles on fiber-optic cables. Such waves—whether a tsunami or a photonic packet of information—are known as solitons. The... » read more

System Bits: July 12

By Ann Mutschler - 12 Jul, 2016 - Comments: 0

Simplifying sensor network interactions Given that the IoT consists of millions of sensing devices in buildings, vehicles and elsewhere that deliver reams of data online, and involves so many different kinds of data, sources and communication modes that its myriad information streams can be onerous to acquire and process, scientists at Georgia Tech Research Institute have developed a flexible,... » read more

System Bits: April 28

By Ann Mutschler - 28 Apr, 2015 - Comments: 0

Transistor encasing for better device performance ECE Illinois researchers have discovered a more effective method for closing gaps in atomically small wires. Led by Professor Joseph W. Lyding and graduate student Jae Won Do, the team reported this new transistor technology comprised of carbon nanotube wires shows promise in replacing silicon because it can operate 10 times as fast and is ... » read more

System Bits: Feb. 17

By Ann Mutschler - 17 Feb, 2015 - Comments: 2

Can you hear light? Silicon photonics has gained increasing attention as a key driver of lab-on-a-chip biosensors and of faster-than-electronics communication between computer chips. The technology builds on tiny structures known as silicon photonic wires. The wires work because light moves slower in the silicon core than in surrounding air and glass. Thus, the light is trapped inside the wire... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ECE Illinois

System Bits: July 10

System Bits: July 12

System Bits: April 28

System Bits: Feb. 17

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