中文 English

Challenges In Printed And Disposable Chips


Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

System Bits: Sept. 23


Contender emerges for 3D IC semiconductor material While silicon has few serious competitors as the material of choice in the electronics industry, transistors cannot keep shrinking to meet the needs of next-gen devices given the significant physical limitations of energy consumption and heat dissipation. To address this, researchers at Harvard University have achieved a reversible change in e... » read more