Startup Funding: Q4 2024

By Jesse Allen - 08 Jan, 2025 - Comments: 0

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 million in the largest round for a chip design startup this year. It was far from the only AI startup, however, as several companies gathered support for neuromorphic designs focused on ultra-low po... » read more

Chip Industry Week In Review

By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Manufacturing Bits: May 17

By Mark LaPedus - 17 May, 2016 - Comments: 0

Isolating diamondoids Stanford and the SLAC National Accelerator Laboratory are finding new ways to isolate diamondoids. Diamondoids, which are tiny specks of diamond, are found in petroleum fluids. The smallest diamondoid consists of 10 atoms. A diamondoid weighs less than a billionth of a billionth of a carat. A carat is a unit of mass equal to 200 mg. [caption id="attachment_27544" ... » read more

Amazing New Materials

By Michael Watts - 20 Mar, 2014 - Comments: 0

Materials are fundamental to active photonics devices, and there were plenty of developments discussed at Photonics West 2014. Element Six was happy to talk about progress in making large single-crystal diamond and even larger polycrystalline diamond wafers. Carbon has a number of stable forms; diamond, graphite, nanotubes and amorphous carbon. The Element Six process uses CVD conditions in ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: Element Six

Startup Funding: Q4 2024

Chip Industry Week In Review

Manufacturing Bits: May 17

Amazing New Materials

Trending Articles

Baby Steps Toward 3D DRAM

What’s Next For Through-Silicon Vias

Chip Industry Week in Review

Strain, Stress In Advanced Packages Drives New Design Approaches

Navigating Increased Complexity In Advanced Packaging

Knowledge Centers
Entities, people and technologies explored