Chip Industry Week In Review

By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit 321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Chiplets Make Progress Using Interconnects As Glue

By Ann Mutschler - 31 Oct, 2024 - Comments: 0

Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn't. While the vision of plug-and-play remains intact, getting there is a lot more complicated than initially imagined. It can ... » read more

UMI: Extending Chiplet Interconnect Standards To Deal With The Memory Wall

By Ramin Farjadrad - 14 Oct, 2024 - Comments: 0

With the Open Compute Project (OCP) Summit upon us, it’s an appropriate time to talk about chiplet interconnect (in fact the 2024 OCP Summit has a whole day dedicated to the multi-die topic, on October 17). Of particular interest is the Bunch of Wires (BoW) interconnect specification that continues to evolve. At OCP there will be an update and working group looking at version 2.1 of BoW. (... » read more

Chip Industry Week In Review

By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Partitioning In The Chiplet Era

By Ann Mutschler - 03 Oct, 2024 - Comments: 0

The widespread adoption of chiplets in domain-specific applications is creating a partitioning challenge that is much more complex than anything chip design teams have dealt with in previous designs. Nearly all the major systems companies, packaging houses, IDMs, and foundries have focused on chiplets as the best path forward to improve performance and reduce power. Signal paths can be short... » read more

Using AI To Glue Disparate IC Ecosystem Data

By Ed Sperling and Ann Mutschler - 26 Sep, 2024 - Comments: 0

AI holds the potential to change how companies interact throughout the global semiconductor ecosystem, gluing together different data types and processes that can be shared between companies that in the past had little or no direct connections. Chipmakers always have used abstraction layers to see the bigger picture of how the various components of a chip go together, allowing them to pinpoi... » read more

UMI Can Scale the Memory Wall

By Eliyan - 25 Sep, 2024 - Comments: 0

While the improvements in processor performance to enable the incredible compute requirements of applications like Chat-GPT get all the headlines, a not-so-new phenomenon known as the memory wall risks negating those advancements. Indeed, it has been clearly demonstrated that as CPU/GPU performance increases, wait time for memory also increases, preventing full utilization of the processors. ... » read more

UMI Can Scale the Memory Wall

By Eliyan - 25 Sep, 2024 - Comments: 0

Simultaneous Bi-Directional Signaling: A Breakthrough Alternative For Multi-Die Assemblies

By Ramin Farjadrad - 29 Aug, 2024 - Comments: 0

In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single die. But this analogy can lead architects and designers into a blind alley from which it becomes impossible to meet system performance and power requirements. The reason lies in fundamental differe... » read more

Chiplets and the Early Adopter’s Dilemma

By Eliyan - 28 Aug, 2024 - Comments: 0

Early adopters of a new technology often face a serious dilemma. On one hand, moving early means exploiting the most aggressive new technology available. But on the other hand, making early technology decisions can lock a product line into a path that will later become uncompetitive—either a single-vendor solution that can’t guarantee continuity of supply, or a roadmap that can’t shift an... » read more

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