Thermal Challenges Multiply In Automotive, Embedded Devices

By Karen Heyman - 02 Jul, 2024 - Comments: 0

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming chiplets into advanced packages with thinner substrates between them. In the past, nearly all of these complex designs were used in tightly controlled environments, such as a large data center, whe... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 15 Feb, 2019 - Comments: 0

Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

The Week in Review: IoT

By Jeff Dorsch - 02 Feb, 2018 - Comments: 0

Finance San Francisco-based Aquabyte has raised $3.5 million in seed funding led by Costanoa Ventures and New Enterprise Associates. Princeton University and strategic investors in the U.S. and Norway also participated in the round. The startup is using computer vision and machine learning to optimize efficiency in fish farming. Aquabyte is first deploying its technology in Norway in cooperati... » read more

Internet Of Things Design Considerations For Embedded Connected Devices

By Mentor, a Siemens Business - 03 Sep, 2015 - Comments: 0

Embedded connectivity has been around since the early days of M2M. But what is new are the many complexities and emerging standards embedded system developers need to know if they are to design the latest IoT device. This paper delves into many of the key considerations developers need to know and discusses the critical areas of IoT security and connectivity along with the importance of a prove... » read more

Embedded Power Management Challenges Grow

By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ann Steffora Mutschler Power management always has been, and will continue to be, a big issue with electronic devices. But when it comes to power management in embedded systems—controlling battery power in a smartphone, an industrial automation or automotive application, among a myriad of other options—the approaches come with different variables. For example, deeply embedded s... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: embedded devices

Thermal Challenges Multiply In Automotive, Embedded Devices

Week in Review: IoT, Security, Auto

The Week in Review: IoT

Internet Of Things Design Considerations For Embedded Connected Devices

Embedded Power Management Challenges Grow

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