Understand MOSFET Switch Behavior Via An LED Driver Simulation

By John Christopher Rice - 01 Jul, 2020 - Comments: 0

Automotive incandescent bulbs have largely given way to more efficient, reliable, stylish, and even safer light emitting diodes (LEDs). LEDs turn on in a fraction of the time and are especially useful in brake lamps, where fractions of a second matter. The challenge in designing an automotive LED lamp is in satisfying government requirements for light output while also being cost effective. Ano... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 12 Jun, 2020 - Comments: 0

Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

A Node Too Far?

By Ed Sperling - 23 Apr, 2020 - Comments: 1

Physics is an unforgiving master. While the semiconductor industry has been actively developing new transistor structures, new materials for interconnects and lining trenches, and new approaches to alleviate congestion at the lowest metal levels, it also has been playing an accelerating game of Whac-a-Mole. Whenever a problem pops up, the solution to that problem is never complete and more prob... » read more

Using Compression For High-Bandwidth Video

By Ed Sperling - 01 Aug, 2019 - Comments: 0

Malte Doerper, senior manager for product management at Synopsys, explains how to improve bandwidth and reduce latency in video without changing out the existing infrastructure through compression, but unlike previous versions of compression there is no significant loss of quality. This approach reduces power, area and heat, as well. » read more

New Issues In Advanced Packaging

By Ann Mutschler - 08 Mar, 2018 - Comments: 1

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Tech Talk: EM Crosstalk

By Ed Sperling - 14 Dec, 2017 - Comments: 0

Anand Raman, senior director at Helic, talks about the impact of electromagnetic interference on digital design at 10/7nm and beyond. Once confined to the analog space, noise is suddenly an issue at advanced nodes for all designs. At the root of the problem are smaller nodes, increased speed and higher levels of integration. https://youtu.be/hzZqK2lNJNQ » read more

Tech Talk: ADAS

By Ed Sperling - 13 Jul, 2017 - Comments: 0

Arvind Vel, director of applications engineering at ANSYS, talks about the transition to self-driving cars and what will be required in future system designs. https://youtu.be/K2xBZZ-vxYQ » read more

Antenna Design Grows Up

By Ann Mutschler - 09 Mar, 2017 - Comments: 2

Apple’s iPhone 4 antenna issue represents a classic example of what can go wrong in modern antenna design. Put one in the wrong place, and a seemingly insignificant part can turn a cool new product into a public relations nightmare. Ever since antennas dropped out of sight, most consumers don't give them a second thought. In the 1960s, almost every home had a rooftop antenna. Fast forward ... » read more

Why Do You Need Chip-Package-System Co-Design And Co-Analysis?

By Youngsoo Lee - 13 Oct, 2016 - Comments: 0

Whether it is the need for sustainable energy, or driving performance while keeping power at bay, or enabling safe and reliable operation of any electronic system, containment of electronic noise — power and signal noise is critical to all of the above. Other factors that impact safe and reliable operation are electromigration (EM), electromagnetic interference (EMI) and mechanical stress ena... » read more

Integration IP Helps IP Integration

By Brian Bailey - 08 Sep, 2016 - Comments: 0

You might not know much about the MIPI Alliance if you aren't designing mobile phones, but you will soon. Other application areas are taking interest in what this group has accomplished. The alliance was founded in 2003 to create standards for hardware and software interfaces in mobile devices. Successful examples include a camera serial interface (CSI) and a display serial interface (DSI), ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?