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Similar But Different — The Tale Of Transient And Permanent Faults


When determining whether an IC is safe from random hardware faults, applying safety metrics such as PMHF, SPFM, and LFM, engineers must analyze both transient and permanent faults. This paper highlights the fundamental differences between permanent and transient faults on digital circuits, and why this distinction is important in the context of the ISO 26262:2018 functional safety standard. ... » read more

Electromagnetic Simulation And 3D-IC Interposers


By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

Clocks Getting Skewed Up


At a logical level, synchronous designs are very simple and the clock just happens. But the clocking network is possibly the most complex in a chip, and it's fraught with the most problems at the physical level. To some, the clock is the AC power supply of the chip. To others, it is an analog network almost beyond analysis. Ironically, there are no languages to describe clocking, few tools t... » read more

Parasitic Characterization Comes To Power Design Simulation


Two power design challenges are taking teams into unfamiliar territory. Wide bandgap (WBG) semiconductors target greater efficiency and density. Stricter EMI compliance regulations now come standard in mission-critical industries. Power design practices are still catching up. Simulation often takes a back seat to respinning hardware prototypes until success. What’s missing that could make sim... » read more

PCB Design Rules For Wiring And Crosstalk


Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces routed very close to each other to optimize packaging and space. This proximity may cause unintentional coupling of electromagnetic fields, a phenomenon which we know by the name of crosstalk (see f... » read more

Understand MOSFET Switch Behavior Via An LED Driver Simulation


Automotive incandescent bulbs have largely given way to more efficient, reliable, stylish, and even safer light emitting diodes (LEDs). LEDs turn on in a fraction of the time and are especially useful in brake lamps, where fractions of a second matter. The challenge in designing an automotive LED lamp is in satisfying government requirements for light output while also being cost effective. Ano... » read more

Week In Review: Auto, Security, Pervasive Computing


Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

A Node Too Far?


Physics is an unforgiving master. While the semiconductor industry has been actively developing new transistor structures, new materials for interconnects and lining trenches, and new approaches to alleviate congestion at the lowest metal levels, it also has been playing an accelerating game of Whac-a-Mole. Whenever a problem pops up, the solution to that problem is never complete and more prob... » read more

Using Compression For High-Bandwidth Video


Malte Doerper, senior manager for product management at Synopsys, explains how to improve bandwidth and reduce latency in video without changing out the existing infrastructure through compression, but unlike previous versions of compression there is no significant loss of quality. This approach reduces power, area and heat, as well. » read more

New Issues In Advanced Packaging


Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

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