tag: EMI

Using Compression For High-Bandwidth Video
By Ed Sperling - 01 Aug, 2019 - Comments: 0

Malte Doerper, senior manager for product management at Synopsys, explains how to improve bandwidth and reduce latency in video without changing out the existing infrastructure through compression, but unlike previous versions of compression there is no significant loss of quality. This approach reduces power, area and heat, as well. » read more

New Issues In Advanced Packaging
By Ann Mutschler - 08 Mar, 2018 - Comments: 1

Advanced packaging is gaining in popularity as the cost and complexity of integrating everything onto a planar SoC becomes more difficult and costly at each new node, but ensuring that these packaged die function properly and yield sufficiently isn't so simple. There are a number of factors that are tilting more of the the semiconductor industry toward advanced [getkc id="27" kc_name="packag... » read more

Tech Talk: EM Crosstalk
By Ed Sperling - 14 Dec, 2017 - Comments: 0

Anand Raman, senior director at Helic, talks about the impact of electromagnetic interference on digital design at 10/7nm and beyond. Once confined to the analog space, noise is suddenly an issue at advanced nodes for all designs. At the root of the problem are smaller nodes, increased speed and higher levels of integration. https://youtu.be/hzZqK2lNJNQ » read more

Tech Talk: ADAS
By Ed Sperling - 13 Jul, 2017 - Comments: 0

Arvind Vel, director of applications engineering at ANSYS, talks about the transition to self-driving cars and what will be required in future system designs. https://youtu.be/K2xBZZ-vxYQ » read more

Antenna Design Grows Up
By Ann Mutschler - 09 Mar, 2017 - Comments: 2

Apple’s iPhone 4 antenna issue represents a classic example of what can go wrong in modern antenna design. Put one in the wrong place, and a seemingly insignificant part can turn a cool new product into a public relations nightmare. Ever since antennas dropped out of sight, most consumers don't give them a second thought. In the 1960s, almost every home had a rooftop antenna. Fast forward ... » read more

Why Do You Need Chip-Package-System Co-Design And Co-Analysis?
By Youngsoo Lee - 13 Oct, 2016 - Comments: 0

Whether it is the need for sustainable energy, or driving performance while keeping power at bay, or enabling safe and reliable operation of any electronic system, containment of electronic noise — power and signal noise is critical to all of the above. Other factors that impact safe and reliable operation are electromigration (EM), electromagnetic interference (EMI) and mechanical stress ena... » read more

Integration IP Helps IP Integration
By Brian Bailey - 08 Sep, 2016 - Comments: 0

You might not know much about the MIPI Alliance if you aren't designing mobile phones, but you will soon. Other application areas are taking interest in what this group has accomplished. The alliance was founded in 2003 to create standards for hardware and software interfaces in mobile devices. Successful examples include a camera serial interface (CSI) and a display serial interface (DSI), ... » read more

Big Data Meets Chip Design
By Ann Mutschler - 16 Jun, 2016 - Comments: 0

The amount of data being handled in chip design is growing significantly at each new node, prompting chipmakers to begin using some of the same concepts, technologies and algorithms used in data centers at companies such as Google, Facebook and GE. While the total data sizes in chip design are still relatively small compared with cloud operations—terabytes per year versus petabytes and exa... » read more

Interference In The Car
By Ernest Worthman - 07 Jan, 2016 - Comments: 0

Once again, a paradigm shift is upon us. Mobile connectivity has radically changed the automobile’s place in the world of connected everything. And that paradigm will shift even further once the IoE is in full bloom. As all of this unfolds and technology marches on, some see the connectivity of the automobile as being a better and more powerful alternative to the smartphone. It is touted a... » read more

System-Aware Full-Chip Power Integrity And Reliability
By Calvin Chew - 12 Nov, 2015 - Comments: 0

At the core of every electronics system is a chip that has to meet multiple conflicting requirements such as increased functionality, best power efficiency, highest reliability, lowest design cost and short design schedule. Meeting these requirements poses a major challenge, especially for systems on chip (SoCs) that are designed using advanced processes. Ensuring that the SoCs meet power an... » read more

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