Uniquely Identifying PCBs, Subassemblies, And Packaging


Securing the semiconductor supply chain is becoming much more difficult as devices increasingly are disaggregated, a shift being forced on the industry due to the rising cost of scaling and the need for more customization and faster time to market. Individual component IDs are an important starting point for supply chain trust, but they are no longer sufficient. Those components will end up ... » read more

Power/Performance Bits: Dec. 31


Three-valued memory Scientists at the Tokyo Institute of Technology and the University of Tokyo developed a new three-valued memory device inspired by solid lithium-ion batteries which could potentially serve as low power consumption RAM. The new device consisted of a stack of three solid layers made of lithium, lithium phosphate, and gold. This stack is essentially a miniature low-capacity... » read more