Broad Impact From Accelerating Tech Cycles

By Ed Sperling - 21 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Complex Chips Make Security More Difficult

By John Koon - 07 Apr, 2022 - Comments: 0

Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Complex Chips Make Security More Difficult

By John Koon - 04 Nov, 2021 - Comments: 0

Siemens-Mentor Deal Retrospective

By Ed Sperling - 21 Aug, 2019 - Comments: 1

Tony Hemmelgarn, president and CEO of Siemens PLM Software and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the acquisition of Mentor Graphics, the shift toward more customized design, and where AI fits into the design picture. SE: How does a company like Siemens see the EDA industry evolving? Hemmelgarn: Part of the reason we bought Mentor Grap... » read more

The Rise Of Parallelism

By Ed Sperling - 27 Apr, 2017 - Comments: 1

Parallel computing is an idea whose time has finally come, but not for the obvious reasons. Parallelism is a computer science concept that is older Moore's Law. In fact, it first appeared in print in a 1958 IBM research memo, in which John Cocke, a mathematician, and Daniel Slotnick, a computer scientist, discussed parallelism in numerical calculations. That was followed eight years later by... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ERP

Broad Impact From Accelerating Tech Cycles

Complex Chips Make Security More Difficult

Complex Chips Make Security More Difficult

Siemens-Mentor Deal Retrospective

The Rise Of Parallelism