Chip Industry Week In Review


Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Chip Industry Technical Paper Roundup: Apr. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Experimental Characterization Results and State-of-the-Art Device-Level Studies of DRAM Read Disturbance


A new technical paper titled "Revisiting DRAM Read Disturbance: Identifying Inconsistencies Between Experimental Characterization and Device-Level Studies" was published by researchers at ETH Zurich. Abstract "Modern DRAM is vulnerable to read disturbance (e.g., RowHammer and RowPress) that significantly undermines the robust operation of the system. Repeatedly opening and closing a DRAM ro... » read more

Research Bits: Mar. 18


High-frequency signal conversion Researchers from ETH Zurich developed a plasmonic modulator capable of converting electrical signals into optical signals with a frequency of over a terahertz. The modulator is a tiny nanostructure made up of various materials, including gold, and makes use of the interaction between light and free electrons within the gold. It converts signals directly, red... » read more

Chip Industry Week In Review


ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Technical Paper Roundup: Mar. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=412 /] Find more semiconductor research papers here. » read more

Solution To Read Disturbance For Current And Future DRAM Chips at Low Area, Performance And Energy Costs (ETH Zurich et al.)


A new technical paper titled "Chronus: Understanding and Securing the Cutting-Edge Industry Solutions to DRAM Read Disturbance" was published by researchers at ETH Zurich, TOBB, and University of Sharjah. Abstract "We 1) present the first rigorous security, performance, energy, and cost analyses of the state-of-the-art on-DRAM-die read disturbance mitigation method, Per Row Activation Count... » read more

Chip Industry Week In Review


The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

← Older posts