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Chip Industry Week In Review

By The SE Staff - 14 Mar, 2025 - Comments: 0

ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Week In Review

By The SE Staff - 08 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 16 Feb, 2018 - Comments: 0

Fab tools and test Applied Materials reported record revenue and operating profit in its first quarter ended Jan. 28. Compared to the first quarter of fiscal 2017, Applied grew net sales by 28% to $4.20 billion. In the second quarter of fiscal 2018, Applied expects net sales to be in the range of $4.35 billion to $4.55 billion. “AMAT posted F1Q results above guidance as NAND demand, in p... » read more

Trending Articles

Chip Industry Week In Review

ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.

by The SE Staff

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Chiplets Add New Power Issues

Well-understood challenges become much more complicated when SoCs are disaggregated.

by Ann Mutschler

3D-IC For The Masses

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?

by Brian Bailey

Knowledge Centers
Entities, people and technologies explored

Related Articles

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

Global IC Fabs And Facilities Report: 2024

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.

by Liz Allan

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

Baby Steps Toward 3D DRAM

Stacking layers means a complete architecture rethink.

by Bryon Moyer

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