Manufacturing Bits: Jan. 26


EU FIB project The European Union (EU) has launched a new project to develop next-generation structures and materials using focused ion beam (FIB) systems. The EU project, dubbed Focused Ion Technology for Nanomaterials or FIT4NANO, is spearheaded by the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) organization. The project aims to bring European researchers and companies together to develop... » read more

Week In Review: Manufacturing, Test


Top story NVIDIA and SoftBank Group Corp. (SBG) have announced a definitive agreement under which NVIDIA will acquire Arm from SBG and the SoftBank Vision Fund in a transaction valued at $40 billion. Market research Here’s the latest fab equipment forecast from VLSI Research: “The semiconductor equipment market has been very resilient in 2020 despite a very challenging macroeconomic ... » read more

Week in Review: IoT, Security, Autos


Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

System Bits: Oct. 9


Bringing plasmonic color to solid materials Researchers at the University of California, Riverside, used silver nanoparticles (AgNPs) to produce plasmonic color-switchable films for solid materials. This effect was previously achieved only in liquids. Rapid and reversible tuning of plasmonic color in solid films, a challenge until now, holds great promise for a number of applications,” sa... » read more

Week in Review – IoT, Security, Autos


Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

System Bits: Sept. 17


Quantum computing R&D in Germany IBM is teaming with the Fraunhofer Society for research and development of quantum computing technology, backed by the German government, which is providing €650 million (about $715.4 million) in funding over two years for the program. IBM has agreed to install a Q System One system at one of its facilities in Germany for the program. The system has 20... » read more

Week in Review: IoT, Security, Auto


Products/Services Rambus agreed to acquire Hillsboro, Ore.-based Northwest Logic, a purveyor of memory, PCIe, and MIPI digital controllers. The transaction is expected to close in the current quarter. Financial terms weren’t disclosed; Rambus said in a statement, “Although this transaction will not materially impact 2019 results due to the expected timing of close and acquisition accountin... » read more

Week in Review: IoT, Security, Auto


Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Week in Review: IoT, Security, Auto


Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production line in Burlington, Vt. The technology, a 90nm SiGe process, is moving to 300mm wafers at GF’s Fab 10 facility in East Fishkill, N.Y. The SiGe technology is called 9HP. “The increasing ... » read more

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