Much Smarter Manufacturing

By Ed Sperling - 22 Oct, 2020 - Comments: 0

Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

Why The IIoT Is Not Secure

By Kevin Fogarty - 02 Aug, 2018 - Comments: 0

The Internet of Things is famously insecure, but not because the technology to build it or secure it is immature. Likewise, severely insufficient security on the Industrial IoT suffers from a lack of will. Neither tech buyers nor providers have yet invested the same effort expended in other areas of the tech world to create and adopt steps that will make everyone safer, according to chipmakers ... » read more

Designing Hardware For Security

By Ed Sperling - 09 May, 2018 - Comments: 1

By Ed Sperling and Kevin Fogarty Cyber criminals are beginning to target weaknesses in hardware to take control of devices, rather than using the hardware as a stepping stone to access to the software. This shift underscores a significant increase in the sophistication of the attackers, as evidenced by the discovery of Spectre and Meltdown by Google Project Zero in 2017 (made public in Ja... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: European Industrie 4.0

Much Smarter Manufacturing

Why The IIoT Is Not Secure

Designing Hardware For Security

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