Manufacturing Bits: Dec. 29

By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Exascale Emulation Debug Challenges

By Ribhu Mittal - 11 Apr, 2019 - Comments: 0

For years, semiconductor industry surveys have shown that functional verification is the dominant phase in chip development and that debug is the most time-consuming task for verification. The problem is getting worse in today’s era of exascale debug, in which software applications drive tests of more than a billion cycles run in emulation on designs of more than a billion gates. System-on-ch... » read more

Fastest Computers On The Planet

By Barry Pangrle - 05 Dec, 2013 - Comments: 0

The latest Green500 list (Excel spreadsheet here) was just released at the end of last month and heterogeneous systems now own the top of the list. The Top 10 systems all use a combination of Intel Xeon (mostly E5) processors paired with NVIDIA K20s. There are now 6 systems listed that have broken the 3,000 MFLOPS/W barrier and TSUBAME-KFC, belonging to the Tokyo Institute of Technology’s GSI... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: exascale

Manufacturing Bits: Dec. 29

Exascale Emulation Debug Challenges

Fastest Computers On The Planet