Week In Review: Design, Low Power

By Marie C. Baca - 30 Sep, 2022 - Comments: 0

Tools and IP Renesas introduced a new microprocessor that enables artificial intelligence to process image data from multiple cameras. "One of the challenges for embedded systems developers who want to implement machine learning is to keep up with the latest AI models that are constantly evolving,” said Shigeki Kato, Vice President of Renesas' Enterprise Infrastructure Business Division. �... » read more

Increasing Performance With Data Acceleration

By Martha DeGrasse - 14 Apr, 2022 - Comments: 0

Increasing demand for functions that require a relatively high level of acceleration per unit of data is providing a foothold for in-line accelerator cards, which could mean new opportunities for some vendors and a potential threat for others. For years, either CPUs, or CPUs with FPGA accelerators, met most market needs. But the rapid increase in the volume of data everywhere, coupled with t... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 14 Feb, 2020 - Comments: 0

Chipmakers and OEMs IC Insights has released its rankings of the 25 largest wafer capacity leaders in terms of monthly installed capacity in 200mm-equivalents as of December 2019. Samsung was in first place, followed by TSMC, Micron, SK Hynix, and Kioxia, formerly Toshiba Memory, according to IC Insights. Combined capacity of the top five companies represented 53% of total global wafer capa... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week In Review: Design, Low Power

Increasing Performance With Data Acceleration

Week In Review: Manufacturing, Test

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