tag: FHE

Weaving A Digital Thread For Design And Manufacture Of Additive Electronics
By Dave Wiens - 04 Jan, 2024 - Comments: 0

Additive manufacturing has been around electronics since thick-film, screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a resurgence in additive manufacturing, also known as printed electro... » read more

A Chiplet-Based Fully Homomorphic Encryption Accelerator
By Technical Paper Link - 18 Aug, 2023 - Comments: 0

A technical paper titled “CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure” was published by researchers at Seoul National University. Abstract: "Fully homomorphic encryption (FHE) is in the spotlight as a definitive solution for privacy, but the high computational overhead of FHE poses a challenge to its practical adoption. Although prior studies have attempted to desig... » read more

Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications
By Technical Paper Link - 15 Aug, 2023 - Comments: 0

A technical paper titled “Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications” was published by researchers at Georgia Institute of Technology. Abstract: "This paper thoroughly investigates material characterization, reliability evaluation, fabrication, and assembly processes of additively manufa... » read more

A Chiplet-Based FHE Accelerator Design Enabling Scalability And Higher Throughput
By Technical Paper Link - 07 Aug, 2023 - Comments: 0

A technical paper titled “REED: Chiplet-Based Scalable Hardware Accelerator for Fully Homomorphic Encryption” was published by researchers at Graz University of Technology and Samsung Advanced Institute of Technology. Abstract: "Fully Homomorphic Encryption (FHE) has emerged as a promising technology for processing encrypted data without the need for decryption. Despite its potential, its... » read more

Programmable HW Accelerators For BGV Fully Homomorphic Encryption In The Cloud
By Technical Paper Link - 02 Aug, 2023 - Comments: 0

A technical paper titled “BASALISC: Programmable Hardware Accelerator for BGV Fully Homomorphic Encryption” was published by researchers at COSIC KU Leuven, Galois Inc., and Niobium Microsystems. Abstract: "Fully Homomorphic Encryption (FHE) allows for secure computation on encrypted data. Unfortunately, huge memory size, computational cost and bandwidth requirements limit its practic... » read more

Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A technical paper titled "Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED" was published by researchers at Tohoku University in Japan. Abstract: "This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100- μm -cubed blue μ LED... » read more

Hardware Accelerator For Fully Homomorphic Encryption
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "CraterLake: A Hardware Accelerator for Efficient Unbounded Computation on Encrypted Data" was published by researchers at MIT, IBM TJ Watson, SRI International, and University of Michigan. "We present CraterLake, the first FHE accelerator that enables FHE programs of unbounded size (i.e., unbounded multiplicative depth). Such computations require very large cipherte... » read more

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body
By Gity Samadi - 20 Oct, 2022 - Comments: 0

By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

T. Fukushima, "Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE," 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: "More recently, "chiplets" are expected for further scaling the performance of LSI systems. However, system integration with the chiplets is not a new methodology. The basic concept dates back well over ... » read more

Challenges In Printed And Disposable Chips
By Susan Rambo And Ed Sperling - 05 Mar, 2020 - Comments: 0

Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

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