Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Jun, 2019 - Comments: 0

Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 18 Jan, 2019 - Comments: 0

Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Dec, 2018 - Comments: 0

Internet of Things Unmanned aerial vehicles are delivering vaccines to the very remote village of Cook’s Bay, on the island of Erromango, one of 83 volcanic islands in the South Pacific nation of Vanuatu. The drones can go from island to island faster than boats, which often are not a travel option during rough weather. Vanuatu this week began its vaccine deliveries by drones with support fr... » read more

The Week in Review: IoT

By Jeff Dorsch - 16 Mar, 2018 - Comments: 0

Cybersecurity The United Kingdom government issued a policy report, Secure by Design, calling on Internet of Things device manufacturers to eliminate default passwords, to provide greater transparency in vulnerability disclosure, and to secure credential storage. The report urges shifting cybersecurity responsibility to IoT device vendors, rather than end-users, and protecting the privacy righ... » read more

The Week In Review: System-Level Design

By Ed Sperling - 14 Feb, 2014 - Comments: 0

Cadence bought TranSwitch’s high-speed interface IP assets. TranSwitch, which made chips for communications equipment, filed for bankruptcy in November. (The company’s Web site is no longer active.) Cadence also won a deal with Microsoft, which will use Tensilica processors in the new Xbox One audio subsystem. And Cadence rolled out HiFi Audio Tunneling for Android, which takes advantage of... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Financial Times

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week In Review: System-Level Design