Why packaging is becoming increasingly critical and difficult in the automotive market.

Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.

Shortages of used equipment and lower margins mean this problem isn’t getting solved anytime soon.

5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.

At future nodes there are some unexpected behaviors. What to do about them isn’t always clear.

As advanced-node chips are added into cars, and usage models shift inside of data centers, new questions surface about reliability.

This more than Moore technology is still ramping up, and problems need to be solved, but it could lead to some fundamental changes.

Cost of porting tools and IP will limit choices at partial nodes and create confusion at others.

The race is on to simulate thermal and electromagnetic effects.

Are optimizations really a zero sum gain? Where to gamble and when to play it safe.

Why new approaches are needed to tie together training and inferencing.

The ways different architectures get around the memory bottleneck.

Heat is becoming a bigger problem for chips developed at new process nodes and for automotive and industrial applications.