Thermal-Mechanical Optimization of 2.5D Flip-Chip Packages With Glass and Silicon Interposers (Univ. of Ottawa)


A new technical paper titled "Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning" was published by researchers at University of Ottawa. Abstract "Advanced 2.5D flip-chip packages with silicon/glass interposers may pose tightly coupled thermo-mechanical trade-offs. This work presents a simulation-driven, ... » read more

Advanced Packaging Fundamentals for Semiconductor Engineers: eBook


Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will follow at some point, whether they're designing their own packages, developing the tools, processes, materials, and methodologies to create them, or developing components that will be used inside of th... » read more

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices


A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more