tag: Framework

Chip Industry Week In Review

By The SE Staff - 07 Feb, 2025 - Comments: 0

The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70% 2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

FPGAs: Automated Framework For Architecture-Space Exploration of Approximate Accelerators

By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems" was published (preprint) by researchers at TU Wien, Brno University of Technology, and NYUAD. Abstract "Generation and exploration of approximate circuits and accelerators has been a prominent research domain exploring energy-efficiency and/or performance... » read more

Trending Articles

Chip Industry Week In Review

ASML-imec deal; Intel Foundry's future; European tech consortium; photonics-related acquisitions; global chip market up; new security IP and algorithms; neuromorphic AI chip; adaptive MCUs; auto superbrains.

by The SE Staff

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Chiplets Add New Power Issues

Well-understood challenges become much more complicated when SoCs are disaggregated.

by Ann Mutschler

3D-IC For The Masses

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?

by Brian Bailey

Knowledge Centers
Entities, people and technologies explored

Related Articles

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

Global IC Fabs And Facilities Report: 2024

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.

by Liz Allan

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

Baby Steps Toward 3D DRAM

Stacking layers means a complete architecture rethink.

by Bryon Moyer

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