Failure Analysis Becoming Critical To Reliability


Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

From Constraints to Tape-Out: Towards a Continuous AMS Design Flow


Author(s): Krinke, Andreas; Horst, Tilman; Gläser, Georg; Grabmann, Martin; Markus, Tobias; Prautsch, Benjamin; Hatnik, Uwe; Lienig, Jens The effort in designing analog/mixed-signal (AMS) integrated circuits is characterized by the largely manual work involved in the design of analog cells and their integration into the overall circuit. This inequality in effort between analog and digital... » read more

Temperature Reduction on a High-Power Thermal Demonstrator


High-power applications in microelectronic devices and systems is a crucial and severe issue that may cause elevated thermal and thermomechanical phenomena and finally lead the fabricated system to degradation, limitation of its performance, or even failure and destruction of its features. In specific applications, such as those found in the industry and the automotive sector, the power pro... » read more